German chip vendor Infineon has received a major boost in the next-generation mobile space, announcing a partnership with Nokia. The two companies are to combine Nokia’s baseband modem technologies and Infineon’s RF solutions, to create solutions for HSPA and LTE devices. The collaboration involves teams from both companies working on the architectural and system challenges to ensure interoperability and compatibility. The fruits of this cooperation will be a verified technology reference platform. The agreement is non-exclusive.

“Taking advantage of each company’s expertise as leaders in their respective fields, this cooperation will help to deliver standard-based, industry leading solutions for mobile internet devices,” said Nokia’s Pekka Sarlund in a statement. As part of the collaboration, the two companies said they would jointly drive the interface standardisation for LTE-Advanced, enabling theoretical peak data rates of up to 1Gb/s. They claimed this interface will “enable a fast roll out of new products and increase competition in the market for advanced modem chipsets.”