ZTE said it is set to unveil a “self-developed chipset” to power 4G devices in September, stating that it will be “the first in the industry to attain 4G standards in communications and data throughput, heralding a breakthrough in 4G technology globally”.
The company did not provide any more details of the silicon, which will be showcased at the PT/Expo Comm China 2013 event in Beijing.
By taking on a greater role in the processor design process, ZTE is echoing the strategy of rivals such as Apple and Samsung. Fellow Chinese player Huawei also has its own semiconductor unit, HiSilicon Technologies.
The company revealed its plans as it highlighted the fact it had a 5 per cent smartphone market share in the second quarter of 2013, according to Strategy Analytics, with shipments of 11.5 million units.